{"id":33867,"date":"2026-05-29T08:39:00","date_gmt":"2026-05-29T06:39:00","guid":{"rendered":"https:\/\/fmd-insight.de\/?p=33867"},"modified":"2026-05-28T12:23:59","modified_gmt":"2026-05-28T10:23:59","slug":"apecs-durchbruch-in-der-chipfertigung","status":"publish","type":"post","link":"https:\/\/fmd-insight.de\/de\/news\/projekt-nachrichten\/apecs-durchbruch-in-der-chipfertigung\/","title":{"rendered":"<strong>APECS<\/strong> | Durchbruch in der Chipfertigung"},"content":{"rendered":"\n    <div class=\"lwn_block lwn_block_full lwn_thewidth lwn_center\" id=\"block_f1e864850b99ecc16f060e94f63073c6\" style=\"height: 250;\" test><div class=\"lwn_block_full_copy\"><\/div>\n        <div class=\"lwn_fullimgcontainer  lwn_nocut \" style=\"height: 250px;\">\n            <div class=\"lwn_paralax_box \"><div class=\"lwn_cutclass \"><div class=\"lwn_copy_box\">\n            <div class=\"lwn_imgbox\">\n                <picture>\n                    <source srcset=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2025\/07\/apecs-pilotlinie-eu-chips-act-keyvisual-aspect-ratio-3840-716-2048x382.png\"\/>\n                    <img decoding=\"async\" src=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2025\/07\/apecs-pilotlinie-eu-chips-act-keyvisual-aspect-ratio-3840-716-2048x382.png\" alt=\"\" class=\"\">\n                <\/picture><\/div><\/div><\/div>\n            <\/div>\n        <\/div>\n        <div class=\"lwn_flexparent lwn_thewidth lwn_center img_overlay \">\n            <div class=\"lwn_flexchild lwn_center\"><\/div>    \n        <\/div>\n\n    \n    <\/div>\n\n\n        <div id=\"block_b31ff1ce9371ed53c6178e975da0988e\" class=\"lwn_block lwn_block_repeater lwn_thewidth lwn_center lwn_repeater_text\" style=\"\" test>\n            <div class=\"lwn_flexparent\">\n            \n                    <div class=\"lwn_flexchild lwn_flex1 \"><p>Im Rahmen der europ\u00e4ischen APECS-Pilotlinie haben Forschende des Fraunhofer IPMS ein Verfahren entwickelt, mit dem sich unterschiedliche Chipkomponenten nahezu nahtlos zu einer einzigen Einheit verbinden lassen. Durch das pr\u00e4zise Einbetten kleiner Chiplets in speziell strukturierte Siliziumtaschen gelang es dem Fraunhofer IPMS, die Vorteile eines kompakten Einzelchips mit der Flexibilit\u00e4t modularer Systeme zu kombinieren. Damit wurde die Machbarkeit der quasi-monolithischen Integration (QMI) demonstriert und die L\u00fccke zwischen klassischem Chip-Packaging und modernster Halbleiterfertigung geschlossen.<\/p>\n<p>Der Ansatz adressiert Anwendungen in den Bereichen Wafer-Level- und heterogene Integration sowie Advanced Packaging.<\/p>\n<p>&nbsp;<\/p>\n<a href=\"https:\/\/www.ipms.fraunhofer.de\/en\/press-media\/press\/2026\/Pilotline-APECS-QMI.html\" target=\"_blank\" class=\"lwn_button lwn_left icon-arrowright lwn_backdrop10 \" >Zur Pressemitteilung<\/a><div class=\"clear\"><\/div>\n                    <\/div>\n            <\/div>\n            \n        <\/div>\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Im Rahmen der APECS-Pilotlinie haben Forschende des Fraunhofer IPMS ein Verfahren entwickelt, mit dem sich unterschiedliche Chipkomponenten nahezu nahtlos zu einer einzigen Einheit verbinden lassen.<\/p>\n","protected":false},"author":138,"featured_media":33871,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[86],"tags":[],"class_list":["post-33867","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-projekt-nachrichten"],"acf":[],"_links":{"self":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/33867","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/users\/138"}],"replies":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/comments?post=33867"}],"version-history":[{"count":5,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/33867\/revisions"}],"predecessor-version":[{"id":33873,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/33867\/revisions\/33873"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/media\/33871"}],"wp:attachment":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/media?parent=33867"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/categories?post=33867"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/tags?post=33867"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}