{"id":34868,"date":"2026-09-01T09:56:19","date_gmt":"2026-09-01T07:56:19","guid":{"rendered":"https:\/\/fmd-insight.de\/?p=34868"},"modified":"2026-09-02T12:25:28","modified_gmt":"2026-09-02T10:25:28","slug":"fmd-nnfc-mou-halbleiterforschung-advanced-packaging","status":"publish","type":"post","link":"https:\/\/fmd-insight.de\/de\/news\/projekt-nachrichten\/fmd-nnfc-mou-halbleiterforschung-advanced-packaging\/","title":{"rendered":"<strong>FMD<\/strong> | Verbund Mikroelektronik und NNFC unterzeichnen MoU"},"content":{"rendered":"\n        <div id=\"block_90e97e8f48bd4522132b1d94e4dbed41\" class=\"lwn_block lwn_block_fullmedia lwn_thewidth lwn_center\" style=\"\" test><div class=\"lwn_cutclass \"><div class=\"lwn_copy_box\">\n            <div class=\"lwn_imgbox\">\n                <picture>\n                    <source srcset=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/04\/fmd_keyvisual-2048x637.jpg\"\/>\n                    <img decoding=\"async\" src=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/04\/fmd_keyvisual-2048x637.jpg\" alt=\"\" class=\"\">\n                <\/picture><\/div><\/div><\/div><div class=\"lwn_caption lwn_backdrop10 no_caption\"><div class=\"lwn_copy lwn_backdrop10\"><span>&copy;<\/span>Fraunhofer Mikroelektronik<\/div><\/div>\n        <\/div>\n\n\n<p class=\"wp-block-paragraph\">Am 19. August unterzeichneten der Fraunhofer-Verbund Mikroelektronik und das koreanische National Nanofab Center (NNFC) in Daejeon, S\u00fcdkorea, ein Memorandum of Understanding (MoU), um die Zusammenarbeit in den Bereichen Halbleiterforschung und -entwicklung sowie Advanced Packaging zu vertiefen. <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Vereinbarung schafft einen Rahmen f\u00fcr die Vernetzung komplement\u00e4rer Forschungsinfrastrukturen und Fachkompetenzen im Hinblick auf gemeinsame Entwicklungsprojekte und industrielle Anforderungen. Stephan Guttowski, Leiter der gemeinsamen Gesch\u00e4ftsstelle des Verbunds Mikroelektronik und der FMD, Dr. Manuela Jungh\u00e4hnel vom Fraunhofer IZM-ASSID und der Pr\u00e4sident des NNFC, Heung Soo Park, besiegelten die Unterzeichnung der Absichtserkl\u00e4rung zwischen den beiden Forschungseinrichtungen. <\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Die Zusammenarbeit umfasst FuE-Infrastrukturen, Advanced Packaging, CMOS-Prozesstechnologie und MEMS. Vor allem aber bietet sie beiden Seiten einen Rahmen f\u00fcr die Entwicklung gemeinsamer Forschungsprojekte und die Verkn\u00fcpfung von Kompetenzen zum Nutzen der Industrie. F\u00fcr den Fraunhofer-Verbund Mikroelektronik ist dies genau die Art von internationaler Zusammenarbeit, die weiter ausgebaut werden soll: Partnerschaften zwischen RTOs, die Expertise und Technologietransfer im Hinblick auf konkrete Entwicklungsbed\u00fcrfnisse miteinander verbinden.<\/p>\n\n\n\n        <div id=\"block_0b80a172ae08655f8e47c9fcc580f115\" class=\"lwn_block lwn_block_repeater lwn_thewidth lwn_center\" style=\"\" test>\n            <div class=\"lwn_flexparent\">\n            \n                <div class=\"lwn_flexchild lwn_flex3 \"><div style=\"height: 250px;\" class=\"lwn_img_heightbox\"><div class=\"lwn_cutclass \"><div class=\"lwn_copy_box\">\n            <div class=\"lwn_imgbox\">\n                <picture>\n                    <source srcset=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_4-400x250.jpg 1x, https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_4-800x500.jpg 2x\"\/>\n                    <img decoding=\"async\" src=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_4-400x250.jpg\" alt=\"\" class=\"\">\n                <\/picture><\/div><\/div><\/div><div class=\"lwn_caption lwn_backdrop10 no_caption\"><div class=\"lwn_copy lwn_backdrop10\"><span>&copy;<\/span>Fraunhofer Mikroelektronik<\/div><\/div><\/div>\n                <\/div>\n                <div class=\"lwn_flexchild lwn_flex3 \"><div style=\"height: 250px;\" class=\"lwn_img_heightbox\"><div class=\"lwn_cutclass \"><div class=\"lwn_copy_box\">\n            <div class=\"lwn_imgbox\">\n                <picture>\n                    <source srcset=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_3-400x250.jpg 1x, https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_3-800x500.jpg 2x\"\/>\n                    <img decoding=\"async\" src=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_3-400x250.jpg\" alt=\"\" class=\"\">\n                <\/picture><\/div><\/div><\/div><div class=\"lwn_caption lwn_backdrop10 no_caption\"><div class=\"lwn_copy lwn_backdrop10\"><span>&copy;<\/span>Fraunhofer Mikroelektronik<\/div><\/div><\/div>\n                <\/div>\n                <div class=\"lwn_flexchild lwn_flex3 \"><div style=\"height: 250px;\" class=\"lwn_img_heightbox\"><div class=\"lwn_cutclass \"><div class=\"lwn_copy_box\">\n            <div class=\"lwn_imgbox\">\n                <picture>\n                    <source srcset=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_2-400x250.jpg 1x, https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_2-800x500.jpg 2x\"\/>\n                    <img decoding=\"async\" src=\"https:\/\/fmd-insight.de\/wp-content\/uploads\/2026\/08\/PN_FMD_MoU_2-400x250.jpg\" alt=\"\" class=\"\">\n                <\/picture><\/div><\/div><\/div><div class=\"lwn_caption lwn_backdrop10 no_caption\"><div class=\"lwn_copy lwn_backdrop10\"><span>&copy;<\/span>Fraunhofer Mikroelektronik<\/div><\/div><\/div>\n                <\/div>\n            <\/div>\n            \n        <\/div>","protected":false},"excerpt":{"rendered":"<p>Am 19. August unterzeichneten der Fraunhofer-Verbund Mikroelektronik und das koreanische National Nanofab Center (NNFC) in Daejeon, S\u00fcdkorea, ein Memorandum of Understanding (MoU), um die Zusammenarbeit in den Bereichen Halbleiterforschung und -entwicklung sowie Advanced Packaging zu vertiefen.<\/p>\n","protected":false},"author":144,"featured_media":34875,"comment_status":"closed","ping_status":"closed","sticky":true,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[86],"tags":[],"class_list":["post-34868","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-projekt-nachrichten"],"acf":[],"_links":{"self":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/34868","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/users\/144"}],"replies":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/comments?post=34868"}],"version-history":[{"count":9,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/34868\/revisions"}],"predecessor-version":[{"id":34888,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/posts\/34868\/revisions\/34888"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/media\/34875"}],"wp:attachment":[{"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/media?parent=34868"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/categories?post=34868"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/fmd-insight.de\/de\/wp-json\/wp\/v2\/tags?post=34868"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}